Fast and solder-less assembly is possible using our EasyPACK 2B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3

Fast and solder-less assembly is possible using our EasyPACK 2B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3

Infineon Technologies AG

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